Turn-Key Metrology for R&D
OmniPix 3.0
Comprehensive microLED wafer and chip testing and defect review. High-resolution nano-EL/PL down to 100nm — measuring chips as small as 1μm, with the full optical, electrical, spectral, and structural picture in a single platform.
KEY FEATURES
Key features
100nm
Optical resolution
Down to 100nm — reaching the scale of a virus, and far beyond what any confocal microscope can achieve.
1μm
Smallest chip measurable
Test all key characteristics on even the smallest microLED chips and contact pads — no other platform goes this small.
1°
Angular resolution
Understand the angular distribution of emitted light and its correlation with structural defects — with 1° precision.
2 in 1
EL & PL in 1 platform
Both electroluminescence and photoluminescence testing in a single system — no cumbersome multi-system integration.
12″
Maximum wafer size
From coupon samples all the way up to 12″ wafers — covering every stage from early R&D through process qualification.
Both
Vertical & flip-chip
Compatible with all microLED chip architectures — vertical, flip chip, horizontal pads and top-emitting configurations.
See OmniPix in Action
Watch how OmniPix 3.0 delivers comprehensive optical, electrical, and structural characterization — on chips as small as 1μm.
TECHNOLOGY
How OmniPix 3.0 Works
OmniPix 3.0 combines patented probe technology with high-resolution optical and structural measurement — giving you the complete picture on even the smallest microLED chips, in a single automated platform.
Automated EL & PL in one platform
System includes both EL and PL testing modalities in a single platform — no need for cumbersome integration of multiple systems.
High-resolution nano-EL
Patented probe technology measures chips as small as 1μm, with high-resolution nano-EL/PL testing down to 100nm.
Angular measurements
Understand the angular distribution of emitted light and its correlation with structural defects — with 1° angular resolution and high collection angle.
Comprehensive set of measurements
Obtain a complete set of optical, electrical, spectral, and structural measurements — including EQE, IV, LIV, PL mapping, and sidewall imaging.
See Full Technical Specifications
Request the OmniPix 3.0 datasheet and our team will be in touch.
APPLICATIONS
Built for every microLED application
OmniPix 3.0 is the characterization tool of choice across the full spectrum of microLED end-markets — from AR microdisplay development to large-format display production.
GET A CLOSER LOOK
See InZiv in Action
The future of microLED begins with InZiv. We would be happy to schedule a confidential call to discuss your specific needs and answer your questions. We can also provide a confidential demonstration of InZiv’s testing and inspection technology on your sample. Discover the technology powering the next generation of microLED displays.
