Silicon photonics production testing
Glide-SiPh PIC
Automated wafer-scale functional testing for silicon photonics — built for the throughput demands of high-volume manufacturing.
Key Features
TECHNOLOGY
How Glide-SiPh PIC Works
InZiv’s proprietary fiber array technology couples directly to silicon photonics wafers at wafer scale — delivering automated, multi-channel electro-optical testing without active alignment or device damage.
Passive Alignment
Vibration-free coupling with no active feedback loop required. The FAU aligns to the wafer edge in seconds — no hexapod, no iterative tuning.
Patented Deep-Trench FAU
A monolithic fiber array unit couples to edge-facets with minimal loss. Supports pitch down to 30µm and handles both edge-coupled and grating-coupled devices.
Multi-Channel Probing
Simultaneous optical and electrical characterization across multiple channels in a single automated pass — insertion loss, pass/fail, and yield mapping together.
Full Wafer Automation
Automated wafer loading, alignment, probe engagement, and stepping across 200mm and 300mm wafers. FOUP compatible. No optical recalibration between cycles.
Key Measurements
Interested in Learning More?
Our engineering team is available to discuss your specific requirements in detail.
GET A CLOSER LOOK
See InZiv in Action
The future of microLED begins with InZiv. We would be happy to schedule a confidential call to discuss your specific needs and answer your questions. We can also provide a confidential demonstration of InZiv’s testing and inspection technology on your sample. Discover the technology powering the next generation of microLED displays.
