Silicon photonics failure analysis
Omni-SiPh LightView
Near-field optical probing that shows you exactly where light travels inside your PIC — not just what comes out the other end.
Key Features
The InZiv Solution
Representative schematic illustrating real-time optical propagation inside a silicon photonics waveguide, based on InZiv electro-optical inspection capabilities.
Root Failure Analysis
Real-Time Optical Visibility Inside Silicon Photonics Circuits
InZiv applies its electro-optical inspection expertise to silicon photonics, addressing a core industry limitation: black-box testing.
Instead of measuring only light in vs. light out, InZiv tracks how light propagates inside waveguides in real time, revealing coupling losses, wavelength-dependent behavior, optical modes, and physical defects that directly impact yield and performance.
This capability enables faster root-cause analysis, tighter process control, and a scalable path from R&D to manufacturing
TECHNOLOGY
How Omni-SiPh LightView Works
InZiv’s near-field optical probing technology images light propagation directly inside the photonic integrated circuit — giving engineers visibility into exactly where light travels, where it degrades, and where it deviates from design.
Near-Field Scanning
Images the waveguide at high spatial resolution — capturing in-circuit light propagation non-destructively, at die and wafer level
In-Circuit Visibility
Maps light propagation through the full device — including resonators, splitters, multi-path routing, and complex optical architectures — not just port-to-port.
Root Cause Localization
When a device underperforms, LightView pinpoints the exact location of optical loss or design deviation. Reduces iteration cycles from weeks to hours.
Flexible Probe Architecture
Near-field, deep-trench, and angled probes adapt to any device geometry. Custom probe designs available for specific customer architectures.
Key Measurements
Technical Specifications
The table below outlines representative performance targets used to illustrate inspection challenges; actual requirements vary by application and system design.
| Parameter | Example Performance Requirement | How InZiv Measures & Enables – Examples |
|---|---|---|
| Access to buried & deep-trench structures | Probe waveguides located deep inside complex SiPh stacks | InZiv designs and fabricates custom deep-trench optical probes with >100 µm tip length, large Z-scan range (~85 µm), and tailored angles, enabling optical access to otherwise unreachable architectures. |
| Waveguide propagation loss | Minimize dB/cm loss across circuit | InZiv tracks light propagation inside the waveguide in real time, directly revealing where optical loss occurs rather than inferring from input/output measurements. |
| Coupling efficiency | High, wavelength-stable coupling | High-NA lensed fiber and angled probes expose coupling inefficiencies and alignment sensitivity that standard I/O tests cannot see. |
| Wavelength-dependent behavior | Stable performance across operating bands | Spatially resolved optical mapping shows how different wavelengths propagate differently in the same structure, enabling fast root-cause identification. |
Interested in Learning More?
Our engineering team is available to discuss your specific requirements in detail.
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See InZiv in Action
The future of microLED begins with InZiv. We would be happy to schedule a confidential call to discuss your specific needs and answer your questions. We can also provide a confidential demonstration of InZiv’s testing and inspection technology on your sample. Discover the technology powering the next generation of microLED displays.
